Applications

 

Solvent-based thermal laminating adhesive

Solvent based adhesive is applied to bond two different materials in injection-modeling machine. In general, Solvent based adhesive is used in insert-modeling process, in order to make the injection material bonding to the other object which put into machine more accurate and tighter. (the deviation reduce to 0.1mm)

There are bounties of advantages when making use of Solvent based adhesive.

A.      Solvent based adhesive is applied to bonding two different (1 list to 2 list see below) materials.

1.       Aluminum magnesium alloy, Magnesium aluminum alloy, SUS, fiberglass, fibercarbon, nylon.

2.       TPU, PC+ABS, PC+fiberglass, PC.

B.      The manufacturing efficiency is more productive than CNC process.

Comparing to the technique NMT, Solvent based adhesive technique make the 3C device thinner and reduce the cost of manufacturing, for instance, All in One, Laptop, Pad, smart phone, and so on.

 

 


 

PUR Moisture reactive hot melt adhesive

PUR is moisture-reactive polyurethane (PU) hot melt adhesive designed for 3C devices assembly and other applications demanding fast curing speed for fast production line. PUR extensively used for bonding bezel and panel module(glass) in various products, for instance, lap top, tablet, mobile, smart watch, and so on.

There are bounties of advantages when making use of PUR.

A. Dispensing Robot Dispenser manufacture automatically

1. Reduce the cost of labor and management.

2. Accelerate the production line.

3. Precision dispensing

4. More stable through robot manufacturing

B. PUR reactive through natural condition(cooling and moisture).

C. Application properties: Bonding, Water-proof, Slender dust-proof.

D. Reworkable fast and simply.

E. PUR is suitable for metal, glass, plastic and other particular material bonding.


 

Other Adhesive