Solvent based adhesive is applied to bond two different materials in injection-modeling machine. In general, Solvent based adhesive is used in insert-modeling process, in order to make the injection material bonding to the other object which put into machine more accurate and tighter. (the deviation reduce to 0.1mm)

There are bounties of advantages when making use of Solvent based adhesive.

A.      Solvent based adhesive is applied to bonding two different (1 list to 2 list see below) materials.

1.       Aluminum magnesium alloy, Magnesium aluminum alloy, SUS, fiberglass, fibercarbon, nylon.

2.       TPU, PC+ABS, PC+fiberglass, PC.

B.      The manufacturing efficiency is more productive than CNC process.

C.      Comparing to the technique NMT, Solvent based adhesive technique make the 3C device thinner and reduce the cost of manufacturing, for instance, All in One, Laptop, Pad, smart phone, and so on.